应用
Copper silicide? thin film? is used for? passivation? of? copper-based chips, where it serves to suppress? diffusion? and? electromigration? and serves as a? diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds.

备注
Stable under recommended storage conditions. Store in cool, dry conditions in well sealed containers.

基本信息

MDL
MFCD00134719

EINECS
235-286-8

分子式
Cu₅Si

分子量
345.79

熔点
825°

灵敏度
Ambient temperatures.

形态
6.35mm & Down Pieces

溶解性
Insoluble in water.

GHS危害和防范说明

GHS符号

Hazard Statements
H315-H319-H335
Causes skin irritation.Causes serious eye irritation.May cause respiratory irritation.

Precautionary Statements
P261-P280a-P305+P351+P338-P304+P340-P405-P501a
Avoid breathing dust/fume/gas/mist/vapours/spray.Wear protective gloves and eye/face protection.IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.IF INHALED: Remove to fresh air and keep at rest in a position comfortable for breathing.Store locked up.Dispose of contents/container in accordance with local/regional/national/international regulations.

安全信息

危险类别
36/37/38
Irritating to eyes, respiratory system and skin.

安全等级
26-37-60
In case of contact with eyes, rinse immediately with plenty of water and seek medical advice.In case of contact with eyes, rinse immediately with plenty of water and seek medical advice.This material and its container must be disposed of as hazardous waste

TSCA
是

基本信息